Hardware & Semiconductors
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Japan Commits $16 Billion Total to Rapidus With Fresh $4 Billion Approval as 2nm Foundry Races Toward 2027 Production
METI approved an additional 631.5 billion yen in support on April 11, raising cumulative Japanese government backing for the state-aligned chipmaker to roughly 2.6 trillion yen through fiscal 2027.
ASML Raises 2026 Revenue Guidance to 36-40 Billion Euros as AI Infrastructure Spending Lifts Q1 Sales to 8.8 Billion
ASML posted 8.8 billion euros in Q1 2026 net sales and upgraded its full-year outlook, citing accelerating capacity expansions at memory and logic customers chasing AI infrastructure demand.
TSMC Posts Record $35.7 Billion Q1 Revenue as AI Chip Demand Drives the First Trillion-NTD Quarter in Company History
TSMC's Q1 2026 revenue surged 35% year-over-year to NT$1.13 trillion, powered by AI accelerator demand and 2nm ramp, as the company prepares a record $52-56 billion capex plan.
Rigetti Launches 108-Qubit Cepheus System, the Largest Modular Chiplet-Based Quantum Computer Available via the Cloud
Rigetti Computing has made its 108-qubit Cepheus-1-108Q system generally available through its own cloud platform and Amazon Braket, marking the first gate-based quantum processor exceeding 100 qubits on AWS.
Cognichip Raises $60 Million to Replace Sequential Chip Design With Physics-Informed AI as Intel CEO Joins Its Board
Cognichip's $60M round brings total funding to $93M as its AI platform works with 30+ semiconductor firms to cut design costs by up to 75 percent.
Credo Acquires DustPhotonics for $750 Million, Bringing Silicon Photonics In-House as AI Data Center Optical Demand Surges
Credo Technology pays $750M cash plus stock for Israeli silicon photonics firm DustPhotonics, targeting $500M in combined optical revenue by fiscal 2027.
RAPID + TCT 2026 Opens in Boston as Defense Spending and Production-Scale Hardware Signal Additive Manufacturing's Industrial Pivot
North America's largest additive manufacturing conference draws 450 exhibitors to Boston as DoD allocates $3.3 billion for AM and vendors unveil production-grade systems.
3GPP Faces June Deadline to Set 6G Specification Timeline as Industry Splits Over AI-Native Ambitions and Security Demands
The 3GPP standards body must decide by June 2026 how long Release 21 work will take, a decision that will set the pace for the first commercial 6G networks expected around 2030.
SK Hynix and SanDisk Launch Global Standardization of High Bandwidth Flash, a NAND-Based Alternative to HBM for AI Inference
The two companies held a formal kick-off event in Milpitas, California, advancing HBF as a new memory tier that promises 8-16x higher capacity than HBM at comparable cost, with first samples expected in the second half of 2026 and inference devices arriving in early 2027.
Samsung Brings Blood Pressure Monitoring to Galaxy Watches in the US After Years of Regulatory Limbo
Samsung has begun a phased rollout of blood pressure monitoring to US Galaxy Watch owners, classifying the feature as a wellness tool under the FDA's updated General Wellness Policy rather than seeking medical device clearance.
India's National Quantum Mission Reaches 1,000-Kilometer Secure Communication Milestone Ahead of Schedule, Powered by Indigenous QKD Technology
India's National Quantum Mission has demonstrated a 1,000-kilometer quantum-secured communication network using QNu Labs' indigenous ARMOS QKD platform, reaching the halfway mark of its 2,000 km target in under two years — well ahead of the original eight-year timeline.
Intel Foundry Demonstrates World's Thinnest GaN Chiplet at 19 Micrometers, Merging Power and Logic on a Single Die
Intel combines gallium nitride power transistors with silicon digital logic on an ultra-thin 19-micrometer chiplet harvested from 300mm wafers, targeting AI data center power delivery and 5G/6G infrastructure.